How is FPC refined?

FPC, also known as flexible circuit board and flexible board, is characterized by high wiring density, light weight and thin thickness. It is an excellent flexible printed circuit board with high reliability; It is widely used in consumer electronic terminal products, such as smart phones, tablets, personal medical devices, etc.



What materials does FPC consist of?



FPC is composed of flexible base material (PI/PET), copper foil (Cu) and adhesive (AD), combined with overlay and reinforcing material (Stiffener).



1. Copper



In terms of material, it can be divided into rolled-anneal copper foil and electrode-positioned copper foil. In terms of characteristics, the mechanical properties of calendered copper are better, and most of them are calendered copper when there is flexibility requirement. The thickness is divided into 1/3OZ, 1/2OZ, 1OZ and 2OZ.



2. Substrate



There are two kinds of base materials: PI (Polyamide) and PET (Polyester). The price of PI is higher, but its flame resistance is better. The price of PET is lower, but it is not heat resistant. Therefore, if there is a welding demand, most of the materials are made of PI. There are generally 1/2mil, 1mil and 2mil in thickness.



3. Adhesive



Generally, there are two kinds of adhesives: Acrylic (acrylic adhesive) and Epoxy (epoxy resin adhesive). The most commonly used is Epoxy adhesive. 0.4-2 mil in thickness, generally 0.72 mil in thickness.



4. Coverlay



The covering film is composed of "base material+adhesive", and its base material is divided into PI and PET. The thickness is 0.5-1.4mil.



5. Stiffener



(1) Function: In order to weld parts, local areas on the soft plate shall be added with reinforcing materials for installation, and the thickness of the soft plate shall be compensated.



(2) Material: PI/PET/FR4/SUS.



(3) Combination mode: PSA (Pressure Sensitive Adaptive): pressure sensitive (such as 3M series);



(4) Ther * * l Set: thermosetting type (bonding strength, solvent resistance, heat resistance, creep resistance)



In PCB proofing, FPC is a special process with certain technical threshold and manufacturing difficulty. Some domestic PCB factories either feel that the production is troublesome, or feel that the number of customers' production is small, resulting in reluctance to do, or relatively little. Jieduobang can make FPC process to meet customers' various PCB proofing needs. At present, in this process, Jetbond can make 1-8 layers; Plate thickness 0.06-0.4mm; The minimum line width/distance of single and double layers is 2mil, and the minimum line width/distance of multiple layers is 3mil; Copper thickness is 0.33~2oz.