Introduction of double-sided FPC and multi-layer FPC

The double-sided FPC has a layer of etched conductive patterns on both sides of the insulating base film, which increases the wiring density per unit area. The metallized hole connects the patterns on both sides of the insulating material to form a conductive path to meet the design and use functions of flexibility. The covering film can protect the single and double conductors and indicate the location of the components.



Multilayer FPC is to press three or more layers of single-sided or double-sided flexible circuits together, form metallized holes through drilling and electroplating, and form conductive paths between different layers. In this way, complex welding processes are not required. Multilayer circuits have great functional differences in terms of higher reliability, better thermal conductivity and more convenient assembly performance.



1. Finished flexible insulating base material



This category is made on flexible insulating substrate, and its finished product is specified as flexible. This structure usually bonds the two ends of many single-sided or double-sided microstrip flexible FPCs together, but its central part is not bonded together, so it has high flexibility. In order to have high flexibility, a thin and suitable coating, such as polyimide, can be used on the conductor layer to replace a thick laminated coating.



2. Finished soft insulation base material



This type is made on soft insulating base material, and its finished product is not specified to be flexible. This kind of multilayer FPC is made of soft insulating materials, such as polyimide film, and laminated into multilayer plates. After lamination, it loses its inherent flexibility.