What are the common types of FPC flexible circuit boards? FPC flexible circuit board processing manufacturer

Shenzhen Lingzhuo Electronics is a one-stop PCBA circuit board processing factory with its own PCB factory and T-chip processing factory. It can provide FPC flexible circuit board production and FPC flexible circuit board processing services!



Common types of FPC flexible circuit boards



At present, there are four types of FPC flexible circuit boards: single-sided, double-sided, multi-layer flexible circuit boards, and rigid flexible combination circuit boards.



1. Single sided flexible circuit board is the lowest cost printed circuit board with low electrical performance requirements. When wiring on one side, a single sided flexible circuit board should be selected. It has a layer of chemically etched conductive patterns, and the conductive pattern layer on the flexible insulation substrate is rolled copper foil. The insulation substrate can be polyimide, polyethylene terephthalate, aramid fiber ester and polyvinyl chloride.



2. A double-sided flexible circuit board is a conductive pattern made by etching one layer on each side of the insulating substrate. Metallized holes connect the patterns on both sides of the insulation material to form conductive pathways to meet the design and functional requirements of flexibility. And the covering film can protect single and double sided wires and indicate the position of the component placement.



3. Multilayer flexible circuit boards are made by pressing three or more layers of single-sided or double-sided FPC flexible circuit boards together, forming metallized holes through drilling and electroplating, and forming conductive paths between different layers. This way, there is no need to use complex welding processes. Multilayer circuits have significant functional differences in terms of higher reliability, better thermal conductivity, and more convenient assembly performance. When designing the layout, consideration should be given to the interaction between assembly size, number of layers, and flexibility.



4. Traditional rigid flexible integrated circuit boards are composed of rigid and flexible substrates that are selectively pressed together. The structure is compact and forms a conductive connection through metallization. If a printed circuit board has components on both the front and back sides, a rigid and flexible circuit board is a good choice. But if all the components are on one side, choosing a double-sided flexible circuit board and laminating a layer of FR4 reinforcement material on its back would be more economical.



5. The FPC flexible circuit board with a hybrid structure is a multi-layer board, with conductive layers composed of different metals. An 8-layer board uses FR-4 as the medium of the inner layer and polyimide as the medium of the outer layer. The leads extend from three different directions of the main board. Each lead is made of different metals. Constantan alloy, copper, and gold are used as independent leads. This hybrid structure is mostly used in the relationship between electrical signal conversion and heat conversion, as well as in low-temperature situations where electrical performance is relatively harsh, and is the only feasible solution. The convenience and total cost of inline design can be evaluated to achieve the best performance price ratio.



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