Preparation before assembly of FPC soft board

These processes need to be prepared for the FPC soft board. Due to material characteristics and connection issues, some processes need to be carried out before T assembly:



1. Polyimide Dielectric or any material that absorbs moisture needs to be pre baked at 125 degrees for one hour, which should be treated based on different soft plate structures. Multilayer soft plates and soft hard bonding plates need longer time to remove moisture. After baking, it is better to complete welding within 15 minutes without delaying a longer time.



2. It is necessary to maintain a certain distance from the board and maintain the separation between the hardware and the first layer of soft board, as space is needed to confirm the welding uniformity.



3. The protruding contact pin is often specified to exceed the range of the solder inner circle, with a typical appearance of 0.062 inches. To meet this requirement, the pin must be cut to the correct length to provide a height from the board plus the height of the soft board, inner corners, protrusions, etc. This requires the use of sharp cutting tools to maintain a minimum of burrs, as burrs can cause interference between soft board assembly and hardware, as well as damage to insulation and gaskets.



4. If there is a simple production of glue or sealing strips, they can be treated with fixed coating, which may be a glue bite or other open device.



5. If there is gold present on the connector pin, the pin should be pre immersed in the correct solder alloy to wash off the gold, in order to verify solderability and assist in rapid soft board bonding.



6. Inspection before assembly of some soft boards is necessary, and it should be confirmed that the FPC soft board and all hardware items are in good condition before being combined.



7. By planning inspections in advance, excessive manpower consumption can be avoided. It can be performed through the final assembly of electrical properties, and it is necessary to ensure contact with the probe.



Although not all soft boards are produced with polyimide resin as the soft board material, many FPC soft boards produced with other materials may suffer from short circuit under high temperature welding environment. Therefore, it is recommended to use polyimide materials to make soft boards to maintain the assembly yield.