Processing Technology and Classification of Flexible Circuit Board Holes

1. Technology for FPC Appearance and Hole Processing of Flexible Circuit Board



At present, punching is the most commonly used method for batch processing of FPC, while CNC drilling and milling are mainly used for small batch FPC and FPC samples. These technologies are difficult to meet the future requirements for dimensional accuracy, especially positional accuracy standards, and new processing technologies are gradually being applied, such as laser etching, plasma etching, chemical etching, and other technologies. These new shape processing technologies have very high positional accuracy, especially the chemical etching method, which not only has high positional accuracy but also high mass production efficiency and low process cost. However, these technologies are rarely used alone and are generally combined with the punching method.



The purpose classification includes flexible circuit board FPC shape processing, FPC drilling, FPC slot processing, and related parts repair. Simple shapes with low precision requirements are all processed using one-time punching. For substrates with particularly high precision requirements and complex shapes, if the processing efficiency may not meet the requirements with a set of molds, the FPC can be processed in several steps, such as inserting the plug part of a narrow pitch connector and positioning holes for high-density installation components.



2. FPC guide hole on flexible circuit board



Also known as positioning holes, the processing of holes is generally an independent process, but there must be a guide hole for positioning between the line graphics. The automated process utilizes a CCD camera to directly identify positioning marks for positioning, but this equipment is expensive and has limited applicability, and is generally not used. The most commonly used method now is to drill positioning holes based on the positioning marks on flexible printed circuit board copper foil. Although this is not a new technology, it can significantly improve accuracy and production efficiency. In order to improve the punching accuracy, a high-precision and less debris punching method is used to process positioning holes.



3. FPC punching of flexible circuit board



Punching is the process of using pre prepared specialized molds to process holes and shapes on hydraulic presses or crank presses. Nowadays, there are various types of molds, and other processes sometimes also use molds.