Make a FPC sandwich plate

FPC laminated by inner graphics commonly do first, and then to print etching made single side or double side board, and included in the specified between the layers, then through heating, pressure and adhesion. In fact, the basic method and that of the 1960 s can not much change, but with more mature materials and process technology, attached to the FPC profes sional features have also become more diversified.

Relative to other forms of PCB, FPC sandwich plate can increase the wiring layer, thus increases the design flexibility; Because of high density, the connection between the components is reduced, thereby improving reliability. In addition, the device also can install circuit and magnetic circuit shielding layer, and the metal core cooling layer in order to satisfy special functions such as shielding, heat dissipation. Of course, multilayer circuit board is not entirely without faults. High cost, long cycle, need high reliability testing method, the above costs will need to greater effort.

To sum up, with the continuous development of electronic technology, especially the large scale and the extensive application of very large scale integrated circuit, FPC sandwich plate is fast development to the direction of high density, high precision, high number there is fine line, small aperture through hole, blind hole buried, high thickness ratio of aperture technology to meet the needs of the market.